AMAOE M9 M10 M11 Low Medium High Temperature Solder Paste Is A New Tool For PCB/BGA SMD Mobile Phone Motherboards | Инструменты

AMAOE M9 M10 M11 Low Medium High Temperature Solder Paste Is A New Tool For PCB/BGA SMD Mobile Phone Motherboards | Инструменты

M9- Lead free silver high temperature solder paste 217° :
Tips for use: Suitable for high maintenance quality requirements of the master, reduce repair.But because of the high temperature, it will be more difficult to maintain.
Features: high temperature 217°, containing silver ingredients, fine and sticky, no bubbling tin planting, even tin beads, solid welding, environmental protection.
2. M10- Solder paste with lead 183° :
Tips for use: Suitable for regular mobile phone maintenance, reduce repair.
Features: medium temperature 183°, fine viscosity, no bubbling tin planting, even tin beads.
3. M11- Lead-free low-temperature solder paste 138° :
Tips for use: Suitable for mobile phone maintenance that cannot withstand high temperature (such as tin planting in the middle layer of iPhone X mainboard maintenance), to reduce the difficulty of maintenance and risk.
Features: low temperature 138°, fine viscosity, no bubbling tin planting, uniform tin bead, reduce maintenance difficulty, reduce the risk, but the welding firmness is not as good as the moderate and high temperature.
4. M13- Solder paste containing silver and lead 190° :
Tips for use: Suitable for regular mobile phone maintenance, reduce repair.
Features: medium temperature 190° c, silver content, better firmness, electrical conductivity, luster, fine viscosity, no bubbling tin planting, even tin beads.