Оплетка для удаления припоя |

Оплетка для удаления припоя |

Specifications:

-Size: 3.5mm*1.5m/3.0mm*1.5m/2.5mm*1.5m/2.0mm*1.5m/1.5mm*1.5m

-Material: copper wire

-Color: bronze

-Melting point: 280 ℃

-Working temperature: 280-480 ℃

-Welding current: 0 (A)

Features:

1. With low residue design-- This solder braid helps clean spare solder on the pin away to avoid short circuit, especially great for small, hard to reach areas.

2. Pure oxygen free copper wire-- No clean flux for easy usage.The solder wick can help clean some residue flux and increase the speed of cleaning the PCB pad.

3. Braid design-- Copper wick with fine braid design to promote strong capillary action to pull in excess solder.

4. Features-- Oxidation resistivity, anti-corrosion protection and good thermal conductivity.

5. Widely use-- Can be used to correct mistakes with small boards on PCBs, remove relays and other components from printed circuit boards, re-solder mechanical keyboard switches, unsoldering old wire from devices, desoldering computer parts such as a motherboard and so on.

6. How to use--

1) Place the wick over the solder need to be removed and then push the heated soldering iron tip onto the wick.

2) Remove the wick at once when the solder has been absorbed.

3) Cut off the used part of the wick.

Notes:

1. Please allowed 1-3mm differences due to manual measurement, thank you!

2. Due to the difference between different monitors, please understand that the picture may not reflect the actual color of the item.

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